Asymtek Millenium 620 Underfill

Year 2000
Spec Sheet
Working Condition

FEATURES
• Supports a full range of inline, advanced IC encapsulation
applications with field-proven, closed-loop control of fluid delivery
and thermal management
• Patented Mass Flow Calibration ensures
accurate, repeatable fluid
dispensing volumes
• Pattern Recognition System reliably locates dispensing
sites in both wirebonded die and flip chip formats
• Flexible material handling system supports process and
multiple substrate carriers and lead frames
• Compact footprint conserves valuableproduction floor space
P R O C E S S P L ATFORM:
MILLENNIUM® M-620 SERIES
HIGH-VOLUME INLINE ENCAPSULATION SYSTEM
The Millennium® M-620 Series system is a fully automatic,
closed-loop controlled fluid dispensing system
configured for high-volume inline semiconductor
encapsulation. It is suitable for contract manufacturers
underfilling CSPs in cell phones and PDAs, and
provides tight control over part handling, thermal
management, and fluid delivery processes. The
system ensures high-production yields for your
specific application requirements including
underfill of flip chips, chip-on-board assembly,
glob top, dam & fill, and cavity fill operations.
Asymtek’s exclusive Fluidmove® for Windows NT®
software controls all machine parameters and
events to achieve high-level system performance
within a familiar Windows® environment. Online
documentation is provided, including contextsensitive
help functions, software-prompted setup,
and system shutdown processes.
The system features a flexible material handling
system that can be configured for a variety of substrate
types and sizes. Process carriers, lead frames,
and multiple substrate carriers are all supported
through flexible Millennium architecture. Multi-zone
substrate heating with dedicated contact or impingement
heating ensures a reliable thermal environment.
Asymtek’s patented Mass Flow Calibration system offers
Millennium closed-loop process control of fluid delivery
and temperature regulation, automatically compensating
for changes in fluid viscosity that occur during the
production cycle.

MOTION SYSTEM:
Type: Brushless DC stepper motor
X-Y Velocity: 381 mm/s (15 in./s)
X-Y Repeatability: ±0.025 mm (0.001 in.), 3 sigma
Z-Axis Repeatability: ±0.025 mm (0.001 in.), 3 sigma
Positional Accuracy: ±0.13 mm (0.005 in.), 3 sigma
Z Travel (Maximum): 89 mm (3.5 in.), typical
configuration with NER lighting
and without needle installed;
actual Z travel is applicationdependent
DISPENSE AREA:
DP-3000 Pump
(Single Action): 355.5 x 269.1 mm (14 x 10.6 in.)
DP-3000 and
DV-6000 Pumps
(with optional
dual-action
dispensing head): 269.1 x 269.1 mm (10.6 x 10.6 in.)
VISION AND LIGHTING:
Vision: ITI vision system with Pattern
Recognition System
Lighting: NER DOAL®
(Diffuse On-Axis Light™)
CONVEYOR:
Type: SMEMA-compatible,
programmable o-ring style
conveyor with pre-dispense,
dispense-heat, and post-dispense
stations
Motorized width adjustment from
50.8 mm (2.0 in.) minimum to
317.5 mm (12.5 in.) maximum
Conveyor speed programmable to
254 mm/s (10 in./s) maximum
Flow Direction: Configurable for left-to-right
(standard) or right-to-left flow
Carrier Width: 266.7 mm (10.5 in.) maximum
38.1 mm (1.5 in.) minimum
Note: Removal of factory-standard, one-inch conveyor spacer block
results in maximum width of 292.1 mm (11. 5 in.)
COMPUTER:
Computer: Pentium®-based PC,
monitor, mouse
SOFTWARE:
User Environment: Fluidmove® for Windows NT®
Operating System: Windows NT
Software Option: SECS/GEM Interface
Networking Option: Network interface card
(Twisted pair Ethernet support)
FLUID DELIVERY METHOD:
DP-3000 Linear Pump
DV-6000 Pump
DV-7000 Heli-flow™ Pump
CUSTOM TOOLING (OPTIONAL):
Impingement: Non-contact forced-air heating
Contact: Vacuum pull-down
with contact heating
Note: Tooling design dependent on application
FACILITIES REQUIREMENTS:
System Footprint: See illustration
Power, Main: 110/120/220/240 VAC, 50/60 Hz,
10A single phase
Power, Tooling: 220/240 VAC, 50/60 Hz,
30A single phase
Air Supply: 552 kPa (80 psi, 5.5 Bar),
up to 85 l/min (3 SCFM) maximum
depending on configuration
System Weight: 431 kg (950 lbs.)
Noise: <70 dBA
Standards Compliance: SMEMA
CE

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