Pace TF1500 BGA Rework System
The TF 1500 is the next generation in automated, cost effective solutions for area array package rework. No other system on the market is easier to use, ensuring operator acceptance and success! Designed for today’s PCBs, the TF 1500 can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs. The TF 1500’s PC based software is so advanced that creating profiles has never been easier. The system guides the operator through an intuitive interface that virtually automates the process. All operations: component pick-up, alignment, placement, and reflow are completed in a single axis, eliminating the risk of component movement after placement. The PCB holder features fine micrometer adjustment for the most delicate X and Y axis alignments. The twin rail, linear bearings provide precision Z axis movement ensuring placement accuracy to within 25 μm (.001”). The optics boast a 72x zoom camera and the highest quality prism available for amazing image clarity. The TF 1500 uses a combination of Convective top heat with powerful IR bottom heating for the most effective, repeatable heating process available today. The TF 1500 is self-contained. and does not require an external air supply or vacuum connections.
